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Amplitude Live Demo at Laser World of Photonics Munich

Amplitude recruits

Two current job offers: A Sales Engineer at Amplitude Laser in Shanghai for managing and developing the company's turnover on the Chinese scientific market...

Premiumlite: A Successful Presentation in Lisses

We were delighted to have received on September 24th a prestigious committee to our offices in Lisses for presenting our Premiumlite laser. Stéphane Branly, Product...

Amplitude Signs a Partnership With Laser Optronic in Italy

Amplitude Laser is proud to announce a new partnership with Laser Optronic S.r.l., a leading Italian company, distributing Continuum's products - standard...

Jean Jerphagnon Prize 2020 won by Yoann Zaouter

Congratulations to Yoann Zaouter, Segment Line Manager at Amplitude, who won the award of the Jean Jerphagnon Prize 2020 with Emmanuel Hugit (astrophysicist). This year,...

Amplitude Laser Talks About High Throughput at AMNMP 2020

Amplitude Laser President and CEO Eric Mottay will give a talk on the 7 october...

Amplitude welcomes new partners in GLOphotonics

Amplitude, a long-time strategic investor in the French startup GLOphotonics is pleased to welcome Trumpf and DMG-MORI as new partners in the company. GLOphotonics...

Amplitude Establishes Its Chinese Subsidiary

May 7th 2018 - Amplitude opens its latest subsidiary, Amplitude China. Located in Shanghai, this office brings together the sales team in direct contact...

A new industrial compression module by Amplitude

Compress is the first industrial product line of nonlinear compression modules available on the market. Compatible...

OPA and OPCPA source

OPCPA Process with Amplitude Lasers

Photocathode and/or laser heater

High efficiency GHz laser processing with long bursts

New article written by Eric Mottay, co-founder and CEO of Amplitude, and Eric Audouard, Industrial Applications expert at Amplitude, published Published 30 January 2023...

Latest Results at Amplitude on High Average Power PW Laser

During the 4th Asia-Pacific Conference on Plasma Physics (web conference), on Oct 27th (16h UTC+9 / 9 am CET), Franck Falcoz, our laser expert,...

Petawatt laser first shot by the King of Spain

Last 18th September, the King and the Queen of Spain presided over the commissioning of the first Spanish petawatt laser - called VEGA and...

Amplitude on its way to Laser World of Photonics Munich 2019

D-5 /

Amplitude extends its ISO 9001 certification to all its manufacturing facilities

With the extension of the ISO 9001 to all our manufacturing locations, Amplitude reaffirms its commitment to provide all our industrial and scientific customers...

Amplitude launches Laser 4.0® service

Industry 4.0,  commonly referred to as the fourth industrial revolution, is rapidly...

3Dチップパッケージングの威力

チップの高性能化、多機能化、低コスト化が進む中、ここ数年、3Dパッケージの開発が進んでいます。 異なる機能を持つ異なるチップ（例えばメモリとICの組み合わせ）を積み重ね、接続することで、3Dパッケージング設計は距離を短縮し、より多くの相互接続を可能にします。その結果、より効率的で高速なシステムが実現します。 チップを重ねるには、分離層が必要です。この層は、チップ間の不要な電気的接続や漏れを防ぐアイソレーターとして機能します。また、チップの熱膨張に合わせた層の熱膨張が、放出される高熱によって生じる張力やひび割れを防ぎます。 この分離層にはシリコンが使われ、TSV（Through Silicon Via）と呼ばれる専用プロセスが導入されてきました。 しかし最近、シリコンの代替材料としてガラスが登場しました。その熱的・機械的特性は、3Dスタックにおいて他の材料と組み合わせた場合にいくつかの利点をもたらすからです。  

Amplitude sponsors Student Award at Photonics West

Remi Meyer, from FEMTO-ST, France, received the best paper awards for his paper "Novel...

Amplitude Press Kit

You will be able to find below a press kit containing various...