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Amplitude Services

Amplitude always commited to high quality service and care for employees and customers worldwide, with activity 24/7.   For any questions regarding your lasers, please email...
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One Website For Amplitude Systèmes, Continuum and Amplitude Technologies

As part of the development of Amplitude Laser Group, we recently closed all the following websites:
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개인정보 보호정책

This page informs you of our policies regarding the collection, use, and disclosure of personal data when you use our Service and the choices...
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Ultrafast laser technology enables internal engraving in glass

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앰플리튜드 레이저 그룹, 국제적 성장 추구를 위해 경영진 확장

과학, 의료 및 산업 부문을 위한 초고속 레이저 분야의 국제적 선도기업인 앰플리튜드 레이저 그룹은 신임 회장으로 데미안 부에를 임명하여 경영진을 지속적으로 강화해 나가고 있습니다.   데미안...
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Amplitude involved in AI

Because AI could help increase global productivity by 40%, allowing workers to focus on more satisfying tasks or solving more complex problems, Amplitude confirms...
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Amplitude at eMicronora

Today is the first day of the digital Salon Micronora - Microtechniques et...
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회사 소개

펨토초 레이저 제작의 글로벌 리더사 앰플리튜드 2018년 도나 스트리클런드와 제라르 모루가 노벨상을 수상함으로써, 펨토초 레이저 기술이 인정받게 되었습니다. 그...
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Amplitude and SourceLab Under Commercial Agreement

Amplitude Laser is proud to announce a new commercial agreement with SourceLAB S.A.S. , a worldwide leading industry provider of laser plasma technology, in...
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University of Paris-Saclay Awards Jury Prize to Loïc Lavenu

Thesis on the ‘Improvement of the Pulse Shortening of High Energy Ytterbium-doped Fiber Laser Sources’ Receives Recognition On December 6th, 2019 Loïc Lavenu...
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The “HIPERDIAS Project” and Amplitude

Presentation of HIPERDIAS Image of the 1 kW installation seeded by one...
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Our measures against the Coronavirus

Dear Partners and customers, The Covid-19 Pandemic is affecting all business organization worldwide including Amplitude, present in Europe, North America and Asia. As of today, our...
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Amplitude and The Big Bang Theory

It is with great pleasure that we can announce our presence in the upcoming episode of...
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Nobel Prize in Physics 2023

 Nobel Prize in Physics 2023 - Attoscience pulses in the spotlight On the occasion of The Nobel Prize Award Ceremony...
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3Dチップパッケージングの威力

チップの高性能化、多機能化、低コスト化が進む中、ここ数年、3Dパッケージの開発が進んでいます。 異なる機能を持つ異なるチップ(例えばメモリとICの組み合わせ)を積み重ね、接続することで、3Dパッケージング設計は距離を短縮し、より多くの相互接続を可能にします。その結果、より効率的で高速なシステムが実現します。 チップを重ねるには、分離層が必要です。この層は、チップ間の不要な電気的接続や漏れを防ぐアイソレーターとして機能します。また、チップの熱膨張に合わせた層の熱膨張が、放出される高熱によって生じる張力やひび割れを防ぎます。 この分離層にはシリコンが使われ、TSV(Through Silicon Via)と呼ばれる専用プロセスが導入されてきました。 しかし最近、シリコンの代替材料としてガラスが登場しました。その熱的・機械的特性は、3Dスタックにおいて他の材料と組み合わせた場合にいくつかの利点をもたらすからです。  
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Amplitude in partnership with Qt-Science in Brazil

Amplitude Laser is proud to announce its new partnership with QT-SCIENCE a leading scientific provider of optical equipment and solutions  in Brazil. “We...
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Amplitude in partnership with Qt-Science in Brazil

Amplitude Laser is proud to announce its new partnership with QT-SCIENCE a leading scientific provider of optical equipment and solutions  in Brazil. “We...