The semiconductor industry tends towards ever smaller and more complex microchips, making the standard production tools of limited use, if not obsolete. The rapid development of new materials and structures linked to advanced packaging of semiconductor devices presents new challenges, leading to the use of increasingly fine laser systems. Offering unrivalled precision, Amplitude’s femtosecond lasers are perfectly-adapted to meet the needs of these new issues.
These lasers are mainly used for:
> Metrology: Wafer thickness measurement and characterization of thin layers
> Selective Ablation: Removal of thin layers from micron to nanometer – without impacting adjacent layers
> Dicing: Dicing of microchips with accuracy and quality, incomparable to current methods (diamond saw and traditional lasers)
> High Precision Drilling: Micrometric drilling for a large range of materials (hard ceramics, polymers or transparent materials)
